Introduction to standards：
IEC 61967-1:2018 can be used as IEC 61967-1:2018 RLV, which contains the international standard and its revised edition, showing all changes in technical content compared to the previous edition.
IEC 61967-1:2018 provides general information and definitions on the measurement of conducted and radiated electromagnetic harassment in integrated circuits. It also provides a description of the measurement conditions, test equipment and settings, as well as test procedures and test report content. Appendix A contains a comparison table of test methods to help choose the appropriate measurement method. The purpose of this document is to describe general conditions to establish a unified test environment and obtain quantitative measurements of radio frequency interference in integrated circuits (IC). Describes the key parameters that are expected to affect the test results. The deviation from this document is clearly indicated in a separate test report. The measurement results can be used for comparison or other purposes. Under controlled conditions, the measurement of the voltage and current of the conducted RF emission or radiated RF interference from the integrated circuit produces information about the possibility of RF interference in the application of the integrated circuit. The applicable frequency range is described in each section of IEC 61967.
Compared with the previous version, this version includes the following major technical changes：
–The frequency range of 150kHz to 1GHz has been removed from the title;
–Frequency step sizes above 1 GHz have been added in Tables 1, 2, and 5.4;
– Table A. 1 Is divided into two tables and Table A in Appendix A. IEC 61967-8 has been added to 2;
–The general test board description has been moved to Appendix D.
Latest standard：
The standard review was updated in April 2024.
- IEC 61967-1: 2018 integrated circuits. Measurement of electromagnetic radiation. Part 1: General Conditions and Definitions
- IEC 61967-1: 2018 Integrated circuits – Measurement of electromagnetic emissions – Part 1: General conditions and definitions
Standard revision history：
| 2018-12-12 | IEC 61967-1：2018 RLV | 2.0 | effective |
| 2002-03-12 | IEC 61967-1：2002 | 1.0 | revision |
Standard catalog：
8.5 Description of software ……………………………………………………………………………. . 16
8.6 Data presentation ……………………………………………………………………………………. 16
8.6.1 General ……………………………………………………………………………………………16
8.6.2 Graphical presentation………………………………………………………………………. . 16
8.6.3 Measurement data ……………………………………………………………………………. . 16
8.6.4 Data processing…………………………………………………………………………………16
8.7 RF emission limits……………………………………………………………………………………. 16
8.8 Interpretation of results ……………………………………………………………………………. . 16
8.8.1 Comparison between IC(s) using the same test method…………………………… 16
8.8.2 Comparison between different test methods …………………………………………. . 16
8.8.3 Correlation to module test methods ………………………………………………………16
Annex A (informative) Test method comparison tables …………………………………………………17
Annex B (informative) Flow chart of a counter test code………………………………………………. 19
Annex C (informative) Description of worst-case application software ……………………………. 20
Annex D (informative) General test board description …………………………………………………. 21
D. 1 General…………………………………………………………………………………………………. . 21
D. 2 Board description – Mechanical …………………………………………………………………. 21
D. 3 Board description – Electrical……………………………………………………………………. . 21
D. 4 Ground planes …………………………………………………………………………………………21
D. 5 Package pins …………………………………………………………………………………………. . 22
D. 5.1 General ……………………………………………………………………………………………22
D. 5.2 DIL packages ……………………………………………………………………………………22
D. 5.3 SOP, PLCC, QFP packages…………………………………………………………………22
D. 5.4 PGA packages…………………………………………………………………………………. . 22
D. 5.5 BGA packages…………………………………………………………………………………. . 22
D. 6 Via diameters…………………………………………………………………………………………. . 22
D. 7 Via distance ……………………………………………………………………………………………. 22
D. 8 Additional components ………………………………………………………………………………22
D. 9 Supply decoupling……………………………………………………………………………………. 22
D. 9.1 General ……………………………………………………………………………………………22
D. 9.2 IC decoupling capacitors ……………………………………………………………………. 23
D. 9.3 Power supply decoupling for the test board ……………………………………………23
D. 10 I/O load…………………………………………………………………………………………………. . 23
Bibliography…………………………………………………………………………………………………………. . 25
Figure B. 1 – Test code flow chart………………………………………………………………………………19
Figure D. 1 – Example of an emission test board …………………………………………………………. 24
Table 1 – Measuring receiver bands and resolution bandwidth (RBW) default settings………. 11
Table 2 – Spectrum analyser bands and RBW default settings………………………………………. 12
Table 3 – IC pin loading recommendations …………………………………………………………………14
Table A. 1 – Conducted emission………………………………………………………………………………. 17
Table A. 2 – Radiated emission …………………………………………………………………………………18
Table D. 1 – Position of vias over the board…………………………………………………………………21
FOREWORD…………………………………………………………………………………………………………… 4
1 Scope ……………………………………………………………………………………………………………… 6
2 Normative references ………………………………………………………………………………………… 6
3 Terms and definitions ………………………………………………………………………………………… 6
4 Test conditions ………………………………………………………………………………………………. . 10
4.1 General…………………………………………………………………………………………………. . 10
4.2 Ambient conditions……………………………………………………………………………………10
4.2.1 General ……………………………………………………………………………………………10
4.2.2 Ambient temperature …………………………………………………………………………. 11
4.2.3 Ambient RF field strength ……………………………………………………………………11
4.2.4 Other ambient conditions ……………………………………………………………………. 11
4.2.5 IC stability over time …………………………………………………………………………. . 11
5 Test equipment………………………………………………………………………………………………. . 11
5.1 General…………………………………………………………………………………………………. . 11
5.2 Shielding…………………………………………………………………………………………………11
5.3 RF measuring instrument …………………………………………………………………………. . 11
5.3.1 General ……………………………………………………………………………………………11
5.3.2 Measuring receiver ……………………………………………………………………………. 11
5.3.3 Spectrum analyser……………………………………………………………………………. . 12
5.3.4 Other RBW for narrowband emissions …………………………………………………. . 12
5.3.5 Emission type, detector type and sweep speed………………………………………. 12
5.3.6 Video bandwidth ………………………………………………………………………………. . 12
5.3.7 Verification of calibration for the RF measuring instrument ………………………. 12
5.4 Frequency range………………………………………………………………………………………13
5.5 Preamplifier or attenuator …………………………………………………………………………. 13
5.6 System gain ……………………………………………………………………………………………. 13
5.7 Other components ……………………………………………………………………………………13
6 Test set-up ……………………………………………………………………………………………………. . 13
6.1 General…………………………………………………………………………………………………. . 13
6.2 Test circuit board ……………………………………………………………………………………. . 13
6.3 IC pin loading…………………………………………………………………………………………. . 13
6.4 Power supply requirements – Test board power supply …………………………………. . 14
6.5 IC specific considerations …………………………………………………………………………. 14
6.5.1 IC supply voltage ………………………………………………………………………………. 14
6.5.2 IC decoupling ……………………………………………………………………………………14
6.5.3 Activity of IC ……………………………………………………………………………………. . 14
6.5.4 Guidelines regarding IC operation ………………………………………………………. . 14
7 Test procedure ………………………………………………………………………………………………. . 15
7.1 Ambient RF noise check ……………………………………………………………………………15
7.2 Operational check ……………………………………………………………………………………. 15
7.3 Specific procedures …………………………………………………………………………………. 15
8 Test report………………………………………………………………………………………………………15
8.1 General…………………………………………………………………………………………………. . 15
8.2 Ambient RF noise ……………………………………………………………………………………. 15
8.3 Description of device ………………………………………………………………………………. . 15
8.4 Description of set-up …………………………………………………………………………………16
Standard text：
This part of IEC 61967 provides general information and definitions for measuring conducted and radiated electromagnetic interference in integrated circuits. It also provides a description of the measurement conditions, test equipment and settings, as well as the content of the test procedures and test reports. A comparison table of test methods is included in annex A to help choose a suitable measurement method.
The purpose of this document is to describe general conditions in order to establish a unified test environment and obtain quantitative measurements of integrated circuit (IC) radio frequency interference. Describes the key parameters that are expected to affect the test results.
Deviations from this document are clearly stated in a single test report. The measurement results can be used for comparison or other purposes.
Measuring the voltage and current of conducted radio frequency emission or radiated radio frequency interference from integrated circuits under controlled conditions can obtain information about potential radio frequency interference in integrated circuit applications.
Each part of IEC 61967 describes the applicable frequency range.
For more content, please purchase the genuine document to view. This article is only an introduction.
- Creation date: April 17, 2024
- Revision date: April 17, 2024