一、IC EMC集成电路电磁兼容测试是什么？
过去，EMC兼容性一直是电子产品模块级或系统级问题。
现在，电子设备制造商开始要求半导体制造商指定集成电路（IC）的辐射和抗扰度水平。一些半导体公司通过开发专有测试方法做出了响应，而另一些公司则与设备制造商和国际电工委员会（IEC）合作，制定了一些通用型的IC EMC测试和测量的标准方法。
二、IC EMC问题来源：
除了布线和结构设计外，设备中所使用的集成电路IC的特性也决定了它的EMC特性。IC对快速脉冲的敏感性随其结构尺寸、工作电压、工作点的较少而显著增加。当前的集成电路和微控制器开发领域趋近于结构小于100nm水平，甚至电脑芯片组已经达到7nm。并且伴随更高的开关率致使IC的EMC-EMS免疫性相较早期产品下降近90%。这种趋势也将最终反映在设备级别的EMC特性上。所以对于相同的功能的IC,良好的EMC特性能够提高IC制造商的竞争优势。
三、如何提高IC的EMC兼容性竞争力？
3.1、提高IC集成电路的电磁兼容性能应该首先从符合IEC标准开始：
在没有相应能力和资质规划符合自己产品的EMC标准时，IC制造商应该首先遵循国际电工委员会IEC的测试标准。然后在利用IEC标准开发符合自己产品的企业标准。
现在，IEC技术委员会TC47（半导体器件）正在领导 IEC 的工作。委员会将 EMC 测量标准的工作分配给其小组委员会 （SC） 47A+集成电路。TC 47/SC 47A 创建了工作组 （WG） 9，以准备测试和测量方法。WG9 的工作计划与其他行业和国家标准机构合作，如美国汽车工程师协会 （SAE） 和德国的埃德列克特罗尼克 Elektronik信息技术公司（VDE）。和产品及设备级别的EMC标准一样，IC-EMC也包括两种测试，射频EMI和射频抗扰度EMS的标准系列。
3.1.1、IEC 61967-EMI电磁发射 序列标准：（查新于20200328）
IEC 61967-1:2018 RLV
Integrated circuits – Measurement of electromagnetic emissions – Part 1: General conditions and definitions
IEC 61967-2:2005
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell method
Show all publications »IEC 61967-4:2002+AMD1:2006 CSV
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
IEC 61967-5:2003
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 5: Measurement of conducted emissions – Workbench Faraday Cage method
Show all publications »IEC 61967-6:2002+AMD1:2008 CSV
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 6: Measurement of conducted emissions – Magnetic probe method
IEC 61967-8:2011
Integrated circuits – Measurement of electromagnetic emissions – Part 8: Measurement of radiated emissions – IC stripline method
IEC TR 61967-1-1:2015
Integrated circuits – Measurement of electromagnetic emissions – Part 1-1: General conditions and definitions – Near-field scan data exchange format
IEC TS 61967-3:2014
Integrated circuits – Measurement of electromagnetic emissions – Part 3: Measurement of radiated emissions – Surface scan method
IEC TR 61967-4-1:2005
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz – Part 4-1: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method – Application guidance to IEC 61967-4
3.1.2、IEC 62132-EMS电磁抗扰度 序列标准：
- IEC 62132-1:2015
Integrated circuits – Measurement of electromagnetic immunity – Part 1: General conditions and definitions - IEC 62132-2:2010
Integrated circuits – Measurement of electromagnetic immunity – Part 2: Measurement of radiated immunity – TEM cell and wideband TEM cell method - IEC 62132-3:2007
Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to 1 GHz – Part 3: Bulk current injection (BCI) method - IEC 62132-4:2006
Integrated circuits – Measurement of electromagnetic immunity 150 kHz to 1 GHz – Part 4: Direct RF power injection method - IEC 62132-5:2005
Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to 1 GHz – Part 5: Workbench Faraday cage method - IEC 62132-8:2012
Integrated circuits – Measurement of electromagnetic immunity – Part 8: Measurement of radiated immunity – IC stripline method - IEC TS 62132-9:2014
Integrated circuits – Measurement of electromagnetic immunity – Part 9: Measurement of radiated immunity – Surface scan method
3.1.3、IEC 62215 EMS脉冲抗扰度 序列标准：
- IEC 62215-3:2013
Integrated circuits – Measurement of impulse immunity – Part 3: Non-synchronous transient injection method - IEC TS 62215-2:2007
Integrated circuits – Measurement of impulse immunity – Part 2: Synchronous transient injection method
3.1.4、IEC 62228 IC-EMC评估方法标准
IEC 62228提供了一些产品的EMC评估方法和流程指导，并引用3.1.1~3.1.3节的测试方法进行测试。
- IEC 62228-1:2018
Integrated circuits – EMC evaluation of transceivers – Part 1: General conditions and definitions - IEC 62228-2:2016
Integrated circuits – EMC evaluation of transceivers – Part 2: LIN transceivers - IEC 62228-3:2019
Integrated circuits – EMC evaluation of transceivers – Part 3: CAN transceivers - IEC 62228-5 ED1
- Integrated circuits – EMC evaluation of transceivers – Part 5: Ethernet transceivers
- PNW 47A-1092
- Future IEC 62228-6: Integrated circuit – EMC Evaluation of transceivers – Part 6: PSI5 transceivers
- IEC 62228-7 ED1
- Integrated circuits – EMC evaluation of transceivers – Part 7: CXPI transceivers
3.1.5、其他标准：
- IEC 62433-1:2019
EMC IC modelling – Part 1: General modelling framework - IEC 62433-2:2017
EMC IC modelling – Part 2: Models of integrated circuits for EMI behavioural simulation – Conducted emissions modelling (ICEM-CE) - IEC 62433-3:2017
EMC IC modelling – Part 3: Models of integrated circuits for EMI behavioural simulation – Radiated emissions modelling (ICEM-RE) - IEC 62433-4:2016
EMC IC modelling – Part 4: Models of integrated circuits for RF immunity behavioural simulation – Conducted immunity modelling (ICIM-CI) - IEC TR 62433-2-1:2010
EMC IC modelling – Part 2-1: Theory of black box modelling for conducted emission - IEC 63011-1:2018
Integrated circuits – Three dimensional integrated circuits – Part 1: Terminology - IEC 63011-2:2018
Integrated circuits – Three dimensional integrated circuits – Part 2: Alignment of stacked dies having fine pitch interconnect - IEC 63011-3:2018
Integrated circuits – Three dimensional integrated circuits – Part 3: Model and measurement conditions of through-silicon via
3.2、使用符合IEC测试标准的测试设备和测试方法测试IC的电磁兼容性能
使用深圳市易优特测试技术有限公司代理的德国langer-emv IC测试系统，使用者可以在开发过程中营造一个逼真的EMC环境，注入各种参数的脉冲. 这样IC电路的设计者能够方便的看到IC对于各类干扰的影响，进而改进芯片的设计。IC测试系统可以在测试时充分的保护IC上敏感脆弱的引脚。
参考文献：IC集成电路芯片的EMC测试方法
IC-EMC测试设备产品线：
IC-EMC测试分类和测试仪器一览表
本文不详细介绍上表中的所有设备，您可以直接在EUTTEST网站搜索产品栏中输入以上型号（例如 P600）查询具体产品的技术参数和测试方法。
下面也会不断更新列出已有的产品说明：
- P603 集成电路测试系统 高频IC引脚电流 符合IEC 61947-4
- P603-1 集成电路测试系统 高频IC引脚电流 符合IEC 61947-4
- P750 集成电路测试系统 高频IC引脚电压 符合IEC 61947-4
- S603 集成电路测试系统 高频IC引脚电流 符合IEC 61947-4
- S750 集成电路测试系统 高频IC引脚电流 符合IEC 61947-4
