Exhibition Profile:

Time of organization:November 14-16, 2025

Place of organization:Shenzhen International Convention and Exhibition Center (New Venue in Bao'an District)

Show highlights:Relying on the "China's first exhibition of science and technology" High Tech Fair, radiating hundreds of billions of South China's electronics market

Global hardware technology giants will soon gather in Shenzhen! On November 14, 2025, the 27th Shenzhen High Tech Fair Integrated Circuit Industry and Application Expo will be opened in the new hall of Shenzhen International Convention and Exhibition Center. As China's largest national science and technology exhibition, the fair is dedicated to IC thematic exhibition, which directly refers to the strategic goal of "chip localization". Shenzhen, with the country's strongest IC design industry foundation, tens of thousands of companies in the field of drones, automotive electronics, 5G communications, etc., to provide a super test bed for chip applications.

Range of exhibition products:

The chip design side showcases core products such as analog/digital-analog hybrid ICs and FPGAs; the manufacturing side assembles leading semiconductor equipment and materials; and the application side presents scenario-based solutions such as AIoT and smart terminals. Especially noteworthy is that the exhibition set up for the first time the "Automotive Electronics Chip Safety Corridor", simulating the chip reliability test under extreme electromagnetic environment, echoing the explosive needs of intelligent networked vehicles4.

Special Clients:

Relying on Huawei, DJI and other local giants, Shenzhen has formed a unique ecology of "application feeding R&D". During the fair, the Chinese Academy of Sciences and other organizations will release the White Paper on Electromagnetic Compatibility of Domestic Automotive Chips, which will provide a key basis for the industry chain to formulate technical standards.

Exhibition planning area:

  • IC Design Zone
  • Integrated Circuit Manufacturing
  • Packaging & Testing
  • IC Related Equipment Zone
  • Discrete Devices

Related Shows:

So far by the end of 2025, the following three exhibitions remain in the electromagnetic test-related industry, with the three exhibitions forming a strategic complement to each other:ChengduFocus on chip manufacturing,Shenzhen subprovincial city in Guangdong, special economic zone close Hong KongHit the ground running with the app,ShanghaiCracking the bottleneck of electromagnetic technology. 2025, China's electronics industry "independent and controllable" battle has entered a critical stage.

“Reminder: swipe tables left and right”
Exhibition Name
timing
core audience
Unique Advantages
July (earliest)
Chip Manufacturing/Packaging Companies
Strong policy orientation, western industrial hub
Shenzhen High-Tech Fair Chip Topics
Mid-November
Smart Hardware Developers
Rich application scenarios and innovative product debuts
Late November
EMC test equipment vendors/material suppliers
Asia's most specialized, technological barrier breakthrough point
“Reminder: swipe tables left and right”